Pattern processing method of a workpiece&#39;s surface

ABSTRACT

A pattern processing method of a workpiece surface includes at least the following steps. A first anodized process is performed to a workpiece, wherein a surface of the workpiece includes at least one flat portion and at least one curved portion. A patterned film including a releasable substrate and an acid-base resistant ink layer disposed thereon is provided, wherein a surface of the releasable substrate on which the acid-base resistant ink layer is disposed faces the workpiece. A force is applied to an edge of the patterned film to adhere the patterned film the workpiece smoothly, so as to transfer a pattern of the acid-base resistant ink layer to the workpiece. The releasable substrate is removed. The workpiece is etched and the acid-base resistant ink layer is removed; and a second anodized process is performed to form a dichromatic anode three-dimensional texture.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Taiwan applicationserial no. 99120097, filed on Jun. 21, 2010. The entirety of theabove-mentioned patent application is hereby incorporated by referenceherein and made a part of this specification.

BACKGROUND

1. Field of the Disclosure

This disclosure is related to a processing method of a workpiecesurface, and in particular to a three-dimensional pattern processingmethod of a workpiece surface.

2. Description of Related Art

Aluminum, titanium, and alloys thereof have advantages such as highstrength and light weight, so that they are widely applied in fieldssuch as aeronautics, electronics, and communication. For example, inorder to enhance the appearance and visual effects of laptop computersor cell phones, the cases thereof may be processed by anodizedprocessing techniques to increase the diversity of the patterns on thecases.

However, in conventional anodized processing techniques, although thevoltages of the two electrodes may be adjusted to manipulate the colorof a surface oxide layer, the thickness of the oxide layer is uniformand does not render a stereoscopic impression showing protrusions andconcaves. In addition, although methods of obtaining oxide films ofdifferent colors by adopting a plurality of anodized processes andcoloring processes have been subsequently developed, these methods canonly be performed to the same flat surface. Hence, when the same methodis performed on a curved surface, problems of discontinuity of colorpatterns and stereoscopic impressions occur.

SUMMARY

The disclosure provides a pattern processing method of athree-dimensional workpiece surface. The method is capable of solvingproblems of misalignment between segments of a pattern on athree-dimensional surface.

The disclosure provides a pattern processing method of a workpiecesurface. The method includes at least the following steps. Performing afirst anodized process to a workpiece, wherein a surface of theworkpiece includes at least one flat portion and at least one curvedportion; providing a patterned film including a releasable substrate andan acid-base resistant ink layer disposed thereon, wherein a surface ofthe releasable substrate on which the acid-base resistant ink layer isdisposed faces the workpiece; applying a force to an edge of thepatterned film, so that the patterned film adheres to the flat portionand the curved portion of the surface of the workpiece, and that apattern of the acid-base resistant ink layer is transferred onto thesurface of the workpiece; removing the releasable substrate; etching theworkpiece and removing the acid-base resistant ink layer; and performinga second anodized process, so that a dichromatic anode three-dimensionaltexture is formed on the surface of the workpiece.

According to an embodiment of the pattern processing method of theworkpiece surface provided by the disclosure, the first anodized processis a hard anodized process.

According to an embodiment of the pattern processing method of theworkpiece surface provided by the disclosure, a thickness of a firstanode layer formed by the first anodized process is greater than athickness of a second anode layer formed by the second anodized process.

According to an embodiment of the pattern processing method of theworkpiece surface provided by the disclosure, an acid-base resistance ofthe first anode layer formed by the first anodized process is greaterthan an acid-base resistance of the second anode layer formed by thesecond anodized process.

According to an embodiment of the pattern processing method of theworkpiece surface provided by the disclosure, a scratch resistance ofthe first anode layer formed by the first anodized process is greaterthan a scratch resistance of the second anode layer formed by the secondanodized process.

According to an embodiment of the pattern processing method of theworkpiece surface provided by the disclosure, a step of heating thepatterned film is included before adhering the patterned film to theworkpiece, so that the patterned film is softened by heat.

According to an embodiment of the pattern processing method of theworkpiece surface provided by the disclosure, the patterned film adheresto the surface of the workpiece by way of a vacuum suction process. Whenperforming the vacuum suction process to the workpiece and the patternedfilm, an edge of the patterned film further adheres to a fixture underthe workpiece.

According to an embodiment of the patterned processing method of theworkpiece surface provided by the disclosure, a width of the dichromaticanode three-dimensional texture on the curved portion of the surface isslightly greater than a width of the dichromatic anode three-dimensionaltexture on the flat portion of the surface.

According to an embodiment of the patterned processing method of theworkpiece surface provided by the disclosure, there is at least one slitat a position where the patterned film corresponds to the curved portionof the surface of the workpiece.

According to an embodiment of the patterned processing method of theworkpiece surface provided by the disclosure, when etching theworkpiece, a portion of the first anode layer not covered by theacid-base resistant ink layer is etched.

According to an embodiment of the patterned processing method of theworkpiece surface provided by the disclosure, the flat portion and thecurved portion are connected continually.

Due to the above, the pattern processing method of the workpiece surfaceprovided by the disclosure is capable of solving the problems ofmisalignment between segments of surface patterns or the problems of inkpermeation at junctions between flat and curved portions of the surface.Hence the pattern on the surface of the workpiece displays a continuousstereoscopic impression and clear contour.

In order to make the aforementioned and other features and advantages ofthe disclosure more comprehensible, embodiments accompanying figures aredescribed in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the disclosure, and are incorporated in and constitutea part of this specification. The drawings illustrate embodiments of thedisclosure and, together with the description, serve to explain theprinciples of the disclosure.

FIG. 1 is a schematic workflow diagram of a pattern processing method ofa three-dimensional workpiece surface according to an embodiment of thedisclosure

FIG. 2 is a schematic cross-sectional diagram of the workpiece after afirst anodized process.

FIG. 3 is a schematic diagram of disposing a patterned film on theworkpiece.

FIG. 4 is a schematic diagram of adhering the patterned film to theworkpiece.

FIG. 5 is a schematic diagram of the workpiece after removing areleasable substrate.

FIG. 6 is a schematic diagram of etching the workpiece and removing anacid-base resistant ink layer.

FIG. 7 is a schematic diagram of the workpiece in FIG. 6 after etchingand after removing the acid-base resistant ink layer.

FIG. 8 is a schematic diagram of the workpiece after a second anodizedprocess has been performed thereto.

FIG. 9 is a schematic three-dimensional diagram of the workpiece afterthe second anodized process has been performed thereto.

DESCRIPTION OF EMBODIMENTS

Pleaser refer to FIG. 1, which is a schematic workflow diagram of apattern processing method of a three-dimensional workpiece surfaceaccording to an embodiment of the disclosure. Referring to both FIGS. 1and 2, as shown in a step S110, a first anodized process is performed toa workpiece 100. As shown in the figures, a surface of the workpiece 100is a three-dimensional surface which includes at least one flat portion110 and at least one curved portion 120. In this embodiment, the flatportion 110 and the curved portion 120 are continually. According to thepresent embodiment, the first anodized process is a hard anodizedprocess, so as to form a first anode layer L1 on the surface of theworkpiece 100, wherein a thickness of the first anode layer L1 is about30 micrometers (μm).

Next, please refer to FIGS. 1 and 3. As shown in a step S120, apatterned film 200 is provided. The patterned film 200 includes areleasable substrate 210 and an acid-base resistant ink layer 220disposed on the releasable substrate 210, wherein the releasablesubstrate 210 is a flexible substrate. According to the presentembodiment, a holding device (not shown) is used to hold an edge of thepatterned film 200, so as to dispose a surface of the patterned film 200on which the acid-base resistant ink layer 220 is located to face theworkpiece 100.

As shown in FIGS. 1 and 4, in a step S130, a force F is applied to theedge of the patterned film 200, so as to adhere the patterned film 200to the workpiece 100.

According to an embodiment of the disclosure, the workpiece 100 whichhas undergone the first anodized process is disposed on a fixture 300,and a vacuum suction device (not shown) is used to continuously suck airout from a space between the workpiece 100 and the patterned film 200.After the patterned film 200 adheres to the flat portion 110 of thesurface of the workpiece 100, since the vacuum suction device stillcontinuously sucks air, thereby exerting the force F to the edge of thepatterned film 200, the patterned film 200 adheres to the first anodelayer L1 on the curved portion 120 of the surface of the workpiece 100smoothly. In addition, before adhering the patterned film 200 to theworkpiece 100 by vacuuming, a heating light tube (not shown) may also beused to heat the patterned film 200, so that the softened patterned film200 adheres to the workpiece 100 more easily by vacuuming.

It should be additionally mentioned that an area of the patterned film200 may be greater than an area of the workpiece 100, so that the edgeof patterned film 200 further adheres to the fixture 300 under theworkpiece 100, thereby enhancing the degree of adherence between thepatterned film 200 and the workpiece 100.

Moreover, the patterned film 200 may also have at least one slit (notshown), and the slit is disposed at a position for cooperation with thecurved portion 120 of the surface of the workpiece 100. When thepatterned film 200 adheres to the workpiece 100, two connecting portionsof the patterned film 200 which are located at two sides of the slit areconnected to each other to form a continuous pattern. The patterned film200 matches the contour of the workpiece 100 more easily and tightlyadheres to the curved portion 120.

The acid-base resistant ink layer 220 is then transferred to the surfaceof the workpiece 100. Different methods such as applying a heated aircurrent, external pressure, or ultraviolet light to the patterned film200 are used according to a material of the acid-base resistant inklayer 220, so that the acid-base resistant ink layer 220 is transferredto the surface of the workpiece 100.

Please refer to FIGS. 1 and 5. As shown in a step S140, the releasablesubstrate 210 is removed, whereas the acid-base resistant ink layer 220remains on the surface of the workpiece 100.

Please refer to FIGS. 1, 6, and 7. As shown in a step S150, theworkpiece 100 is etched, and the acid-base resistant ink layer 220 isremoved. According to the present embodiment, a portion of the firstanode layer L1 not covered by the acid-base resistant ink layer 220 isetched, and the first anode layer L1 that is etched forms a plurality ofconcave parts C. The surface of the workpiece 100 is exposed by theconcave parts C. Next, the acid-base resistant ink layer 220 is removed.

Still referring to FIGS. 1, 8, and 9, as shown in a step S160, a secondanodized process is performed, so that a dichromatic anodethree-dimensional texture is formed on the surface of the workpiece.

When performing the second anodized process, the second anode layer L2is formed on the concave parts C of the first anode layer L1. If thefirst anode layer L1 is compared with the second anode layer L2, thefirst anode layer L1 has a greater thickness (the first anode layer L1is about 30 μm thick, and the second anode layer L2 is about 3 μmthick), and a color of the second anode layer L2 should preferably belighter than a color of the first anode layer L1.

Since a hard anode process is adopted for the first anode layer L1, thefirst anode layer L1 has advantages such as having a longer life spanand being harder, scratch resistant, and acid-base resistant. In otherwords, an acid-base resistance of the first anode layer L1 is greaterthan n acid-base resistance of the second anode layer L2, and a scratchresistance of the first anode layer L1 is greater than a scratchresistance of the second anode layer L2. The first anode layer L1 isable to extend deep into pores on the surface of the workpiece 100,thereby enhancing bonding effects with the workpiece 100. When thesecond anodized process is performed afterwards, the second anode layerL2 is only formed on the surface of the workpiece 100 that is exposed bythe concave parts C of the first anode layer L1, and does not easilycover the un-etched portions of the first anode layer L1.

In summary, in the workpiece processed by the pattern processing methodof the three-dimensional workpiece surface, through at least the abovesteps, the patterned film continuously adheres to the surface of theworkpiece by the vacuum suction process. Even if the surface of theworkpiece includes portions which are connected but not linearlycontinuous, curved surfaces, or surfaces of other shapes, the continuouspattern of the acid-base resistant ink layer is still completelytransferred to the first anode layer which is fabricated on the flatportion and the curved portion connected to the flat portion. Comparedwith conventional art, the continuity of the pattern is enhanced.Moreover, by performing a plurality of anodized processes, anode layersof different thicknesses are formed, so that the pattern renders astereoscopic impression showing protrusions and concaves and has a clearcontour. In other words, the workpiece processed by the patternprocessing method of the workpiece surface provided by the disclosurehas patterns with advantages such as clear contours and a continuousstereoscopic impression, and does not have the disadvantages such as thesurface of the workpiece being divided into linearly discontinuous flatportions and curved portions or discontinuous stereoscopic impressions.

Although the disclosure has been described with reference to the aboveembodiments, it will be apparent to one of the ordinary skill in the artthat modifications to the described embodiment may be made withoutdeparting from the spirit of the disclosure. Accordingly, the scope ofthe disclosure will be defined by the attached claims instead of theabove detailed descriptions.

1. A pattern processing method of a workpiece surface, comprising:performing a first anodized process to a surface of a workpiece, whereinthe surface of the workpiece comprises at least one flat portion and atleast one curved portion; providing a patterned film, comprising areleasable substrate and an acid-base resistant ink layer disposed onthe releasable substrate, wherein a surface of the releasable substrateon which the acid-base resistant ink layer is disposed faces theworkpiece; applying a force to an edge of the patterned film to adherethe patterned film to the flat portion and the curved portion of thesurface of the workpiece, so that a pattern on the acid-base resistantink layer is transferred onto the surface of the workpiece; removing thereleasable substrate; etching the workpiece and removing the acid-baseresistant ink layer; and performing a second anodized process, so that adichromatic anode three-dimensional texture is formed on the surface ofthe workpiece.
 2. The pattern processing method of the workpiece surfaceas claimed in claim 1, wherein the first anodized process is a hardanodized process.
 3. The pattern processing method of the workpiecesurface as claimed in claim 1, wherein a thickness of a first anodelayer formed by the first anodized process is greater than a thicknessof a second anode layer formed by the second anodized process.
 4. Thepattern processing method of the workpiece surface as claimed in claim1, wherein an acid-base resistance of a first anode layer formed by thefirst anodized process is greater than an acid-base resistance of asecond anode layer formed by the second anodized process.
 5. The patternprocessing method of the workpiece surface as claimed in claim 1,wherein a scratch resistance of a first anode layer formed by the firstanodized process is greater than a scratch resistance of a second anodelayer formed by the second anodized process.
 6. The pattern processingmethod of the workpiece surface as claimed in claim 1, furthercomprising a step of heating the patterned film before adhering thepatterned film to the workpiece, so that the patterned film is softenedby heat.
 7. The pattern processing method of the workpiece surface asclaimed in claim 1, wherein a method of adhering the patterned film tothe surface of the workpiece is a vacuum suction process.
 8. The patternprocessing method of the workpiece surface as claimed in claim 7,wherein when performing the vacuum suction process to the workpiece andthe patterned film, the edge of the patterned film further adheres to afixture under the workpiece.
 9. The pattern processing method of theworkpiece surface as claimed in claim 1, wherein a width of thedichromatic anode texture disposed on the curved portion is slightlygreater than a width of the dichromatic anode texture disposed on theflat portion.
 10. The pattern processing method of the workpiece surfaceas claimed in claim 1, wherein there is at least one slit at a positionwhere the patterned film corresponds to the curved portion of thesurface of the workpiece.
 11. The pattern processing method of theworkpiece surface as claimed in claim 1, wherein when etching theworkpiece, a portion of the first anode layer not covered by theacid-base resistant ink layer is etched.
 12. The pattern processingmethod of the workpiece surface as claimed in claim 1, wherein the flatportion and the curved portion are connected continually.